: Guangdong Taijin Semiconductor Technology Co., Ltd

A manufacturer for semiconductor package equipment include Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold

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Industrial SOP4/6/8 MGP Semiconductor Mold Smooth Surface Finish

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Semiconductor Molding Machine [25]
Trim And Form Machine [25]
IC Lead Frame Stamping Mold [19]
MGP Mold [30]
Trimming Forming Dies [25]
Mold Chase [6]
Semiconductor Molding Equipment [25]
Chip Sorting Machine [25]

Guangdong Taijin Semiconductor Technology Co., Ltd

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City: Dongguan

Province/State: Guangdong

Country/Region: China

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Industrial SOP4/6/8 MGP Semiconductor Mold Smooth Surface Finish

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Industrial SOP4/6/8 MGP Semiconductor Mold Smooth Surface Finish

SOP4/6/8 MGP Mold Technical Parameters 1. Plastic dual -oil cylinder with a built -in gear shift drive multi -injection molding design; 2. The roughness of the cavity can achieve 0.2um.max; 3. Special ...

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Industrial MGP Mold

Industrial Semiconductor Mold

Semiconductor Mold Smooth Surface

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